JCID Chip Underfill UF6008, made for Nand CPU packaging, provide original packaging experience!
Product advantages
✅ The underfill will diffuse to the bottom of the chip evenly within 1-3 minutes
✅ Cure within 1 min/under 150C or within 5 min/under 100C automatically
✅ Being softened under high temperature, simplify the process of rework
✅ Superior adhesiveness, improve the anti-dropping resistance, rework is reduced, prolong the service life of the device
Storage conditions: keep stored in cool places at room temperature
Experience JCID Chip Underfill right now, Make your maintenance work more professional and reliable
JCID official website: www.jcprogrammer.com
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