Technology strives to break barriers, and products require innovation. Looking back at the month of May, our dedicated research and development team, driven by the spirit of engineers, continued to explore technology and improve our products. We brought four version upgrades to the V1S Pro and introduced three new products: Chip Underfill Adhesive UF6008, 14-15 Series Front Camera Repair FPC & Adaptor, and 15 Series Rear Camera Repair Flex FPC & Adaptor (Soldering Type).
At JCID, we actively explore diverse product development to provide richer repair scenarios and facilitate easier repair work. From product upgrades to new product releases, we have repeatedly demonstrated our forward-thinking vision and independent innovation through practical actions.
1. V1S Pro Version Upgrades
To meet market demands and enhance user experience, the team courageously faced challenges and tackled technical obstacles with four version updates to the V1S Pro in May. Focusing on "Optimization, Addition, and Resolution," the V1S Pro evolved from version V1.92 to V1.95.
Optimization:
We optimized certain functions and the overall system, addressing issues and continually improving operational stability and smoothness
Addition:
New features were introduced with each version upgrade. For example, the V1.94 version added support for testing the 15 Series screens, better serving repair work.
Resolution:
We expanded coverage for various repair scenarios, enhancing repair efficiency. For instance, the V1.95 version resolved issues related to cloud burning of the rear camera.
2. Chip Underfill Adhesive UF6008: Engineered for CPU Packaging
To improve CPU packaging, we are pleased to introduce our new product, Chip Underfill Adhesive UF6008. This product beautifies chip gaps, reinforces chips, and effectively enhances chip drop resistance, achieving results comparable to OEM encapsulation, rivaling non-UV adhesive.
Four Key Advantages :
1.Fast and Even Dispersion: The adhesive evenly defills to the chip's bottom within 1-3 minutes.
2.Automatic Curing: Self-curing at 150°C for 1 minute or 100°C for 5 minutes.
3.High-Temperature Softening: Simplifies rework processes and increases efficiency.
4.Superior Adhesion Strength: Enhances drop resistance, reduces rework, and extends device lifespan.
3. 14-15 Series Front Camera Repair FPC & Adaptor
JCID launched the "14-15 Series Front Camera Repair FPC & Adaptor," specifically designed to address repair issues caused by non-original front cameras on the 14-15 Series.
14 Series Front Camera FPC:
Solve the problem of out-of-focus photography and rear camera lag after cinematic mode is switched caused by non-original front camera
15 Series Front Camera FPC:
Solve the problem of out-of-focus photography and photos and the progress bar of videos taken by front and rear cameras with white background caused by non-original front camera
14-15 Series Front Camera Read/Write Adaptor
Solve the problem of out-of-focus photography, rear camera lag after cinematic mode is switched and saved photos and the progress bar of recorded videos with white background caused by non-original front camera
(Tips: This product supports V1S Pro and V1SE devices, but not V1S.)
4. 15 Series Rear Camera Repair FPC & Adaptor (Soldering Type):
Replaces the original rear camera FPC by soldering, solve the pop-up and pairing problems caused by the non-original rear camera.
(Tips: This product supports V1S Pro and V1SE devices, but not V1S.)
The above new products provides a wider range of solutions for repair professionals, enabling them to tackle various repair challenges with ease. We will continue our efforts in constant improvement and innovation, delivering high-quality products and services to the industry as we step forward into a new era. Stay tuned for more new solutions!
JCID official website: www.jcprogrammer.com
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