Market Price: US $ /PC
• The underfill will diffuse to the bottom of the chip evenly within 1-3 minutes
• Cure within 1 min/under 150°C or within 5 min/under 100°C automatically
• Being softened under high temperature, simplify the process of rework
• Superior adhesiveness, improve the anti-dropping resistance, rework is reduced, prolong the service life of the device
Specifications:
|
Product Name |
Chip Underfill |
|
Model |
UF6008 |
|
Brand |
JCID |
|
Storage conditions |
keep stored in cool places at room temperature |
|
Made for |
Nand CPU packaging |
Features:
JCID UF6008 Chip Underfill is a highly reliable and efficient solution for Nand CPU packaging. With its exceptional features, including rapid and even diffusion, automatic curing, softening under high temperatures. And superior adhesiveness, improve the anti-dropping resistance, rework is reduced, prolong the service life of the device. Make your maintenance work more professional and reliable.
List of Packing:
Package Details:
Box Dimension:
Carton Dimension:
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